LPACS® – A metalorganic package system for modular microsystem components

The licensing offer regards the conception and creation of a construction kit for modular microsystem components building on the Match-X concept developed by the VDMA (the German Engineering Federation) and the Fraunhofer Institutes IPA and IZM.

Further Information: PDF

PVA Mecklenburg-Vorpommern AG
Phone: +49 (0)381/49 74 74 0

Contact
Antonio Martinez

Media Contact

info@technologieallianz.de TechnologieAllianz e.V.

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