Trade Fair News

Fraunhofer IVV Dresden presents new systems for improving process efficiency at interpack 2017

The Fraunhofer IVV Dresden will present two new systems for efficient process management at interpack 2017 from 4-10 May 2017 in Düsseldorf on the stand of the…

Cebit 2017: A new simulation process makes complex hardware and software compatible

Technology used in cars, aeroplanes and industrial robots is becoming increasingly complex. Can the software be extended? How does the system handle errors?

atmoFlex – Fraunhofer FEP enhances its facilities for coating plastic films

A leader in thin-film technology R&D, the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP in Dresden, Germany, has…

nano tech in Tokyo: IVAM joint pavilion presented the enormous range of nanotechnology

nano tech in Japan is the world's largest international nanotechnology exhibition and conference. More than 53,000 international experts visited the nano tech…

PLUGandWORK connects existing machines and systems to Industrial Internet-of-Things (IIoT)

PLUGandWORKTM helps you connect your legacy plant floor equipment into all the major Industrie 4.0 and Industrial Internet-of-Things players such as IBM…

CeBIT 2017: The washroom of the future: Wireless sensor systems prevent soap etc. topped up

Washrooms are among the highest-maintenance rooms in companies. A new Fraunhofer technology now monitors soap, cotton towel and toilet paper dispensers fully…

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